Electromagnetic Compatibility For Highspeed Circuits – Emc Challenges – Power Distribution Network – Decoupling Capacitors – Power–Ground Planes And Power–Ground Grids – Throughsilicon Via – D Integration And Throughsilicon Vias – Emc Problems Related To Tsv – Signal Delay – Core Devices – I/O Devices – Interconnector – Simultaneous Switching Noise – Cross Talk – Impedance Mismatching – Emc Modeling – Field–Circuit Hybrid Method – Pdn Modeling – Power–Ground Pair Modeling – D Finitedifference Method – Scattering Matrix Method – Connection Of Power–Ground Pairs – Throughsilicon Vias Modeling – Partial Element Equivalent Circuit Method – Electric Field Integral Equation – Series Branch – Parallel Branch – Peec Circuit – Emc Designs – Shield Box – Cross Talk – Differential Signaling – Via Stub – Silicon Loss – Electromagnetic Bandgap – Nearfield Scanning – Organization Of This Book – References – Modal Field Of Power–Ground Planes And Grids – Wave Equation And Its Solution By Using The Green’s Function – Twodimensional Wave Equation .
