Modeling And Design Of Electromagnetic Compatibility For High-Speed Printed Circuit Boards And Packaging

Modeling And Design Of Electromagnetic Compatibility For High-Speed Printed Circuit Boards And Packaging

Contents

• Electromagnetic Compatibility For Highspeed Circuits
• Emc Challenges
• Power Distribution Network
• Decoupling Capacitors
• Power–Ground Planes And Power–Ground Grids
• Throughsilicon Via
• D Integration And Throughsilicon Vias
• Emc Problems Related To Tsv
• Signal Delay
• Core Devices
• I/O Devices
• Interconnector
• Simultaneous Switching Noise
• Cross Talk
• Impedance Mismatching
• Emc Modeling
• Field–Circuit Hybrid Method
• Pdn Modeling
• Power–Ground Pair Modeling
• D Finitedifference Method

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